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Introduction to Materials Science for Engineers (5th Edition), by James F. Shackelford
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This book provides balanced, current treatment of the full spectrum of engineering materials, covering all the physical properties, applications and relevant properties associated with engineering materials. The book explores all of major categories of materials while offering detailed examinations of a wide range of new materials with high-tech applications. The reader is treated to state-of-the-art computer generated crystal structure illustrations, offering the most technically precise and visually realistic illustrations available. The book includes over 350 exercises with sample problems to provide guidance. Materials for Engineering, Atomic Bonding, Crystal Structure and Defects, Diffusion, Mechanical Behavior, Thermal Behavior, Failure Analysis & Prevention. Phase Diagrams, Heat Treatment, Metals, Ceramics and Glasses, Polymers, Composites, Electrical Behavior, Optical Behavior, Semiconductor Materials, Magnetic Materials, Environmental Degradation, Materials Science. For mechanical and civil engineers and machine designers.
- Sales Rank: #201743 in Books
- Published on: 1999-12-30
- Original language: English
- Number of items: 1
- Dimensions: 10.38" h x 1.63" w x 8.50" l, 4.04 pounds
- Binding: Hardcover
- 800 pages
From the Back Cover
This book provides balanced, current treatment of the full spectrum of engineering materials, covering all the physical properties, applications and relevant properties associated with engineering materials. The book explores all of major categories of materials while offering detailed examinations of a wide range of new materials with high-tech applications. The reader is treated to state-of-the-art computer generated crystal structure illustrations, offering the most technically precise and visually realistic illustrations available. The book includes over 350 exercises with sample problems to provide guidance. Materials for Engineering, Atomic Bonding, Crystal Structure and Defects, Diffusion, Mechanical Behavior, Thermal Behavior, Failure Analysis & Prevention. Phase Diagrams, Heat Treatment, Metals, Ceramics and Glasses, Polymers, Composites, Electrical Behavior, Optical Behavior, Semiconductor Materials, Magnetic Materials, Environmental Degradation, Materials Science. For mechanical and civil engineers and machine designers.
Most helpful customer reviews
1 of 1 people found the following review helpful.
Are there better books than this?
By Jon
This book is okay. It has a lot of important information in it, and good examples, but they are pretty well hidden among the unnecessary gibber. It's a good book, however I didn't really use it much, other than doing problems and the example problems.
1 of 2 people found the following review helpful.
Chapter 2 Review
By A Customer
Chapter 2 does a good job of describing the fundamentals of atomic bonding. The chapter starts out by reviewing the basic structure of the atom being the nucleus and the electrons. The nucleus is the center of the atom that is made up of protons and neutrons while the electrons are contained in the surrounding "shells" or orbitals. Throughout the beginning they explain the differences between the two types of bonding that can occur between atoms, the preliminary and the secondary bonding. They include the ionic, covalent, metallic, and the Van der Waals bonds. There are a few ideas that are mentioned for a reminder such as the mass of the proton and neutron, electron and Avagadro's number, which represents the number of protons necessary to provide a mass of 1 gram. There is an explanation of the orbital system and hybridization and a brief description of the different bonds mentioned in the preliminary and secondary bonding. Not only does the author describe the basics of the bond it does a good job of determining the origin of the bond, such as the ionic bond being the result of the Coulombic attraction. As a result of the easily understood explanations, they do supply brief definitions of the bond length, repulsive force, bonding force and bonding energy. Another topic that is touched on is the idea of the coordination number (CN) which depends on the ion properties. Following the CN, a definition of the different properties of the bonds and electrons and bond angles is thoroughly explained. Another thorough explanation is provided for the "Van der Waals" bonding, which is the attraction of opposite charges while there is no actual electron exchange. There are two types being permanent and temporary. I would recommend this book for a thorough explanation of the atomic structure.
1 of 2 people found the following review helpful.
A decent book, Ch6 for example
By A Customer
Chapter 6 covers the topic of Mechanical Behavior in 6 sub-sections. These sections include the stress versus strain relationship (a.k.a. Young's Modulus), elastic and plastic deformation, hardness, creep and stress relaxation, and viscoelastic deformation.
Section one discusses Young's Modulus in relation to metals, ceramics and glasses, and polymers. In this sub-section, engineering stress/strain and the differences between elastic/plastic deformations are discussed, as well as yield strength and tensile strength. This section includes some nice reference tables, and describes the stress/strain curve in great detail.
Sections two and three discuss elastic and plastic deformations. In the latter section, the slip plane for crystalline solids is well covered with some interesting illustrations.
Section four discusses hardness tests, in particular, Rockwell hardness and Brinell hardness numbers.
Creep and stress relaxation are discussed in section five, and covers the dislocation climb in plastic deformation among other topics. I feel that a better explanation regarding the preexponential constant is needed in this section.
The last section deals with viscoelastic deformation, and discusses various topics such as the glass transition temperature, viscous deformation, and softening temperatures. Also of interest is the subject of tempered glass, which is discussed in some detail.
This chapter does well in describing the general terminology and includes several equations with a practical application through example problems. In my opinion, though, this chapter doesn't cover enough information to answer some of the end of chapter problems, but a little on-line research should yield the required information.
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